| 发明名称 |
MOLDING MATERIAL,METHOD FOR SEALING ELECTRONIC ELEMENT,AND SEALED ELECTRONIC ELEMENT |
| 摘要 |
A moulding composition comprising liquid-crystalline monomers and synthetic resin fibres, in particular aromatic polyamide fibres, has a very low coefficient of thermal expansion after curing. Such a moulding composition can very suitably be used for encapsulating an electronic component, in particular a semiconductor device. |
| 申请公布号 |
JPH02212560(A) |
申请公布日期 |
1990.08.23 |
| 申请号 |
JP19890320705 |
申请日期 |
1989.12.12 |
| 申请人 |
PHILIPS GLOEILAMPENFAB:NV |
发明人 |
RIFUATSUTO ATA MUSUTAFUA HIKUMETSUTO;DEIRUKU YAN BUROORU |
| 分类号 |
C08L101/00;C08F2/44;H01L23/29;H01L23/31 |
主分类号 |
C08L101/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
