Substrate material with irregular surface for use on implant device, formed by masking with random pattern, then blasting

摘要

An attachment surface for an implantable device has an irregular pattern formed through a process including masking, chemical or electrochemical etching, blasting and debris removal steps. Surface material is removed from the implant surface without stress on the adjoining material and the process provides fully dimensional fillet radii at the base of the surface irregularities. This irregular surface is adapted to receive the ingrowth of bone material and to provide a strong anchor for that bone material which is resistant to cracking or breaking. The surface is prepared through an etching process which utilizes the random application of a maskant and subsequent etching in areas unprotected by the maskant. This chemical etching process is repeated a number of times as necessitated by the nature of the irregularities required in the surface. The blasting and debris removal steps produce microfeatures on the surface that enhance the ingrowth of bone material.