| 摘要 |
PURPOSE:To relax the stress due to difference in coefficient of thermal expansion of a substrate and a ceramic chip element to prevent the generation of cracks in joined part by electrically conductively bonding the chip element to a conductive region provided on a base consisting of a heat resistive organic film. CONSTITUTION:As a heat resistive organic film, a film consisting of polyimide resin, glass-epoxy resin, polyester resin, Teflon resin can be used. A base 2 consisting of these films has a pair of first conductive regions 3 and a pair of second conductive regions 7. This capacitor 1 is fixed to an alumina substrate 8 by that after the second conductive regions 7 is temporarily fixed to conductive adhesive layers 10 applied to connecting terminals 9 provided on the alumina substrate 8, the first conductive regions 3 are bonded to the connecting terminals 9 by solder layers 11. |
