Technique of assembling structures using vapor phase soldering

摘要

A process for assembling parts of a lightweight structure of aluminum having a multitude of joints. The process includes the following steps: (1) cleaning surfaces of all the parts; (2) selectively depositing on the surfaces a layer of nickel and then tin; (3) selectively plating on the tin layer where joints occur a lead/tin eutectic alloy solder; (4) add flux; (5) fixturing the parts together to form the structure; (6) heating the structure in a vapor phase apparatus; (7) removing the structure from the fixture; and (8) cleaning the structure. By using the above process an antenna faceplate having over 3000 joints was soldered.