| 摘要 |
PURPOSE:To mount a multitude of kinds of semiconductor pellets by a method wherein a metal layer having an exposed part is provided and a metallic wiring is made connectable to the power pad of each semiconductor pellet on an internal wiring region through an insulating layer. CONSTITUTION:A ceramic substrate 1 is formed with a recess-shaped mounting part 9 and an internal wiring 3 having a stitch 3A for connecting wires 6 and contains alumina as its main component. Moreover, a W layer 4 having an exposed part, to which the wires 6 can be connected, is formed integrally with the wiring 3 on a region provided with the wiring 3 through an insulating layer. Thereby, a mounting of a multitude of kinds of semiconductor pellets 5 becomes possible. For example, if the layer 4 is connected to external terminals 2 to connect to a power supply, a power pad of each pellet 5 and the layer 4 can be connected to each other whenever the power pad of the pellet 5 is located. Here, the power pad of each pellet 5 and the wiring 3 can be connected by the wires 6A and 6B and in case the power pad and the layer 4 are connected to each other, the connection becomes possible by the wire 6C. |
