发明名称 |
Three step process for treating plastics with alkaline permanganate solutions |
摘要 |
Process for the planting of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
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申请公布号 |
US4948630(A) |
申请公布日期 |
1990.08.14 |
申请号 |
US19890313587 |
申请日期 |
1989.03.14 |
申请人 |
ENTHONE, INC. |
发明人 |
COURDUVELIS, CONSTANTINE I.;DELGOBBO, ANTHONY E. |
分类号 |
C23C18/22;H05K3/00;H05K3/18;H05K3/38 |
主分类号 |
C23C18/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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