| 摘要 |
PURPOSE:To mount a semiconductor pellet reliably by a method wherein a solder piece molded in such a way that the thicknesses of both ends of the piece are different from each other is interposed between a metal post and the pellet and the pellet is soldered on the post. CONSTITUTION:A molding is performed in such a way that the wall thickness of one end of a tabularly stretched metal solder becomes thin between a metal post 5 and a semiconductor pellet 7 and thereafter, a wedge-shaped solder piece 16 cut out in a size to nearly coincide with the configuration of the pellet 7 is interposed between the pellet 7 and the post 5 and the pellet 7 is heated and fused to solder on the post 5. When such the piece 16 is interposed and the pellet 7 is slantingly placed and heated on the post 5, the piece 16 begins to fuse from the thin part of its thickness, the inclination of the pellet 7 results in being corrected, voids and the like, which are included in the fused solder, are pushed out and the pellet 7 can be mounted on the post 5 without including voids. |
