发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE, LEAD FRAME TO BE USED THEREFOR AND MOLDING DEVICE
摘要 PURPOSE:To contrive the improvement of the utilization efficiency of a molding material by a method wherein a plurality of pieces of lead frames formed integrally in multi-column and multi-row are respectively formed in the cavities of a molding device and the molding material is injected and filled in the cavities through other cavities on the upstream side and connecting paths. CONSTITUTION:A plurality of pieces of unit lead frames 12 are aligned and are continuously connected integrally to form a multiple lead frame 11. These multiple lead frames 11 are aligned in a plurality of rows by a connecting frame 18 and are integrally formed to form a multi-column and multi-raw lead frame 10. Pellets 21 are respectively bonded on tabs 15 of each unit lead frame 12 of the lead frame 10 and an electronic circuit of each pellet 21 and each lead 17 are electrically connected to each other. Then, the lead frames 10 are respectively housed in each of cavities consisting of top force cavity recessed parts 53a and bottom force cavity recessed parts 53b, which are formed by putting top and bottom forces 51 and 52 of a molding device together, a molding material resin is injected and filled in the cavities through runners 58, other cavities on the upstream side, connecting paths 60, through gates 61 and cavities on the downstream side and resin-sealed packages are formed.
申请公布号 JPH02203544(A) 申请公布日期 1990.08.13
申请号 JP19890024657 申请日期 1989.02.01
申请人 HITACHI LTD 发明人 SAKAMOTO TOMOO
分类号 H01L21/56;B29C45/14;B29L31/34;H01L23/48;H01L23/50 主分类号 H01L21/56
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