| 发明名称 |
IMPROVED COOLING SYSTEM FOR SEMICONDUCTOR MODULES |
| 摘要 |
A cooling structure (10) for a semiconductor package (16,18) wherein the cooling fluid is circulated over the cooling fins (24) over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted. |
| 申请公布号 |
EP0285779(A3) |
申请公布日期 |
1990.08.08 |
| 申请号 |
EP19880102433 |
申请日期 |
1988.02.19 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GOTWALD, CHARLES ALLEN;OKTAY, SEVGIN;SHARMA, AJAY;SONNAD, VIJAY;ZINGHER, ARTHUR RICHARD |
| 分类号 |
H01L23/467;H01L23/473;(IPC1-7):H01L23/46 |
主分类号 |
H01L23/467 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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