| 摘要 |
PURPOSE:To enhance a speed, a sensitivity and to reduce in size an optical semiconductor device by inserting an optical semiconductor element having a function of emitting a light or photodetecting into the surface recess of a mounting board having electric wirings, and connecting the electrodes of the optical semiconductor elements via the electric wirings and solder bumps. CONSTITUTION:A GaAs-IC 13 for operating as a preamplifier, a power source pad 14 are formed on the surface of a GaAs-IC board 10. A semiconductor photodetector 1 has surface incidence type, a photodetecting region 2, a front face electrode 3, a rear face electrode 4 and pattern wirings 5. A bias voltage is applied between the front face electrodes 3 and the rear face electrode 4 to operate the photodetector 1. The electrode 3 is connected to a wiring 5. The photodetecting surface of the photodetector 1 is perpendicular to the board 10, and a groove 11 is so inserted that the wiring 5 is brought into contact with a pattern wiring 12 on the board and the electrode 4 is brought into contact with the power source pad 14. The wiring 5 and the electrode 4 are respectively connected to the electrode 4 and the pad 14 via solder bumps 8, 9. Thus, a parasitic capacitance, a parasitic inductance can be reduced, and a high speed, a high sensitivity and a small size are provided. |
