Resin composition for printed circuit board and such board formed by use thereof,申请号US19870122268-传众专利搜索

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发明名称	Resin composition for printed circuit board and such board formed by use thereof
摘要
申请公布号	US4946734(A)	申请公布日期	1990.08.07
申请号	US19870122268	申请日期	1987.11.18
申请人	HITACHI, LTD.	发明人	SUGAWARA, KATUO;TAKAHASHI, AKIO;ONO, MASAHIRO;NARAHARA, TOSHIKAZU
分类号	C08G73/06;C08G73/12;H05K1/03	主分类号	C08G73/06
代理机构		代理人
主权项
地址

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