| 摘要 |
PURPOSE:To realize a circuit board which is high in thermal conductivity, small in thermal expansion coefficient, low in power loss, and high in signal propagation speed by a method wherein aluminum nitride is used as a board material and metal small in electric resistance is used as an inner wiring material. CONSTITUTION:A package main body 10 of aluminum nitride 24, whose upside is covered with an aluminum nitride layer 24 so as to prevent conductor wiring sections 12 and 14 from exposing outside, is burned. The conductor wiring sections 12 and 14 are formed of one or more kinds of metals selected from gold, copper, and silver. And, before an external lead pin 22 is fitted, the surface of the package main body 10 is abraded to expose the conductor wiring sections 12 and 14. |
