发明名称 Method of forming borderless contacts
摘要 A method of forming semi-conductor devices components wherein there are at least two exposed conducting regions having passivating material overlying said regions. The passivating material is subject to etching by a given etchant. At least one, but less than all of the regions are covered with a material, preferably an electrical conducting material, which also preferably covers additional electrical conducting or semi-conducting regions. Thereafter, all the regions are subjected to the given etchant, but only those regions having the passivating material not covered with the etch resistant material are removed. Preferably, at this point, a layer of conducting material is deposited over all the regions.
申请公布号 US4944682(A) 申请公布日期 1990.07.31
申请号 US19890453368 申请日期 1989.12.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CRONIN, JOHN E.;CRONIN, SUSAN F.;KAANTA, CARTER W.;KOBURGER, III, CHARLES W.;LUCE, STEPHEN E.;PEARSON, DALE J.
分类号 H01L21/60;H01L21/768 主分类号 H01L21/60
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