| 摘要 |
PURPOSE:To transfer a wafer from a chuck of an automatic surface grinding machine with its ground surface retained in a non-contacting condition by releasing the wafer adhering by vacuum suction to the chuck and allowing liquid to gush to float the wafer so that a retaining member can be inserted under the floating wafer for conveyance. CONSTITUTION:A ringed portion 4b of a transfer arm 4 is brought under a grinding-finished semiconductor wafer A adhering to by vacuum suction to a suction stand 2b of a chuck mechanism 2. Then, liquid W is allowed to gush from below the suction stand 2b of the chuck mechanism 2 to release vacuum. This causes the semiconductor wafer A to float on the liquid. Subsequently, a retaining member 4a is drawn out so that a non-ground surface of the wafer A is supported by the retaining member 4a for its conveyance. This arrangement allows the wafer to be transferred with its ground surface retained in a non- contacting condition. |
