METHOD OF MANUFACTURING A SUBSTRATE FOR PLACEMENT OF ELECTRICAL AND/OR ELECTRONIC COMPONENTS

摘要

In a method for manufacturing of substrate for placement of electrical and/or electronical components a base of preferably metallic material is first sandblasted and thereafter by means of a thermal process coated with a bonding layer of for instance copper powder, whereafter the bonding layer are coated with a dielectric layer of ceramic material which also is applied by means of a thermal process, the ceramic material thereafter being impregnated with silicone oil. Thereafter the ceramic layer is provided with a dielectric conducting layer, also by means of a thermal process, the predetermined conducting pattern being formed by means of a template. Finally the finished substrate is cleaned by blasting with glass spheres.