SOLDER JOINT MATERIAL FOR HIGH-STRENGTH JOINT OF CONDUCTING ELECTRONIC COMPONENTS

摘要

PURPOSE: To provide a solder for reinforcing soldering performance of a solder bump preformed on a semi-conductor chip by incorporating a specified weight % of tin, lead and conducting high strength single phase solid solder bonding. CONSTITUTION: The solder bonding material contains about 0.5-2 wt.% tin and about 98-99.5% lead. High strength single phase solid solder bonding is conducted in a range of about 0-200 deg.C using the material. A weight % of tin is made nearly equal to the value at which a composition is changed from a single phase solid αstate to a two phase solid α plus β state at about 0 deg.C or smaller, by this method, a high yield semi-conductor wafer is produced.