| 摘要 |
PURPOSE:To eliminate the immersion of resin in the case of forming multilayer and to enhance density by blocking one opening of a through hole formed at a both-side copper-plated substrate by plating technique. CONSTITUTION:A through hole 4 is formed at both-side copper-plated substrate 1, a through hole plating 5 is formed in the through hole 4, and a mask 6 for blocking the through hole 4 is adhered to at least one face of the board 1. A plating layer 7 for blocking the opening of the mask 6 side is formed in the through hole 4 by electroless plating and/or electrolytically plating. Accordingly, when the mask 6 is removed, the plated layer 7 blocks the opening of one side of the through hole 4. Thus, improper conduction due to the immersion of the resin at the time of filling is eliminated, and high density and high reliability multilayer interconnection substrate is obtained. |
