| 摘要 |
PURPOSE:To shorten the time required to complete a resin-sealed type semiconductor device by a method wherein a region to which a wire of an inner lead is connected and a region of a pellet-loading position are heated to a temperature which is higher than that of an outer lead and an external terminal of a semiconductor pellet is connected to the inner lead by using the wire. CONSTITUTION:A region to which at least wires 5 of inner leads 3B of a soldered lead frame 3 are connected and a tab part 3A are heated to a temperature (about 200 deg.C), which is higher than that of inner leads 3C, by using a heating block 7 which heats the region to which the wires 5 of the inner leads 3B are connected and the tab part 3A; external terminals of a semiconductor pellet 2 are connected to the inner leads 3B by using the wires 5. It is possible to reduce defective connections between the external terminals of the semiconductor pellet 2 and the inner leads 3B and the wires 5; the outer leads 3C of the soldered lead frame 3 are not heated directly; accordingly, it is possible to eliminate that a solder layer 4 formed on the surface of the outer leads 3C is melted. |
