| 摘要 |
<p>PURPOSE:To reduce the thermal load on a fan, to reduce the size of the fan, and to reduce noises, by cooling a part having the greatest heating value in a computer by air other than cooling air. CONSTITUTION:A hole 3 formed in the bottom of a computer 1 communicates with the hole 4 in a floor. On both sides or at the circumference of a power source circuit package part, flow passages 5 for cooling air are provided and air passed through the holes 3 and 4 flows to layers F2 and F3 through the flow passages 5. A heat exchanger 6 is provided in the middle of a circulation flow passage 7 extending to a heat exchanger 9 under the floor 2, and is positioned on the power source device package part. Thus, heat exchange is carried out between circulation flow passages 7 and 8.</p> |
