| 摘要 |
<p>PURPOSE:To make the slicing and separation of a wafer possible without developing cracking and chipping on the surface of the wafer and adhering sawdusts to the surface of the wafer by a method wherein two high speed rotary grinding wheels, the directions of rotation of which are differed from each other and the outer diameters of which are equal to each other, are mounted on two rotary shafts of a rotary shaft head so as to lie on same line. CONSTITUTION:A wafer 1, which is placed onto a table, is sliced in one direction with a grinding wheel 4a through the running of a rotary shaft head 5a to the direction indicated with the arrow 7a and simultaneously the high speed rotation of the grinding wheel. Next, the rotary shaft head 5a is fed by the predetermined pitch normal to the plane of the page and, after that, run opposite to the direction indicated with the arrow 7a from the position, at which the rotary shaft head 5a is stopped and which is opposite to the position of the rotary shaft head 5a before running. As a result, the wafer 1 is sliced in one direction with a grinding wheel 4b. The rotary shaft head 5a is reciprocatingly run in succession as described above so as to slice the whole surface of the wafer 1 in one direction. Next, the table is turned for 90 deg. so as to perform dicing in the direction normal to said one direction in order to complete the slicing and separation of the wafer 1.</p> |
