CLEANING OF SEMICONDUCTOR WAFER, ETCHING THEREOF AND SEMICONDUCTOR WAFER TREATMENT DEVICE,申请号JP19880331404-传众专利搜索

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发明名称	CLEANING OF SEMICONDUCTOR WAFER, ETCHING THEREOF AND SEMICONDUCTOR WAFER TREATMENT DEVICE
摘要
申请公布号	JPH02177327(A)	申请公布日期	1990.07.10
申请号	JP19880331404	申请日期	1988.12.27
申请人	MITSUBISHI ELECTRIC CORP	发明人	OMORI MASASHI;WASHITANI AKIHIRO;TAMURA KOICHI
分类号	H01L21/306;H01L21/304	主分类号	H01L21/306
代理机构		代理人
主权项
地址

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