| 摘要 |
<p>PURPOSE:To enable only an upside of a head to be brazed by a method wherein a base plate is fitted the base of a stand to provided an empty space, the leg of a lead pin is housed in the space, a solder powder is filled into an engaging recess where the head of the lead pin is engaged, and the stand is thermally treated in a reducing atmosphere in an oven. CONSTITUTION:A leg 1b of a lead pin 1 is put through a through-hole 6c of a stand 6, and a head 1a of the lead pin 1 is engaged with an engaging recess 6b to make the lead pin 1 droop in the through-hole 6c. Keeping these component parts in this state, a solder powder 4 is filled in the engaging recess 6b through an automatic distributor, and then a base plate 7 is made to bear against a frame 6a to be brought into close contact with it for the formation of a space 8. When the stand 6 constituted as mentioned above is put in an atmosphere of N2+H2, the upside of the head 1a of the lead pin 1 is covered with a reducing atmosphere, and the leg 1b of the lead pin 1 is put in a oxidizing atmosphere state through air inside the space 8. By this setup, when the stand 6 is heated as being placed in an electric oven keeping it in this state, the solder 4 can be made to adhere to only the head 1b of the lead pin 1.</p> |
