| 摘要 |
PURPOSE:To obtain the title composition improved in moldability, cracking resistance and humidity resistance by mixing a silicone-modified epoxy resin and/or a silicone-modified phenolic resin. CONSTITUTION:An epoxy resin composition essentially consisting of 5-40wt% epoxy resin (A), 2-20wt.% phenolic resin (B), a 0.01-1wt.% cure accelerator (C), 0.01-1wt.% colorant (D), 30-90wt.% filler (E), and 0.1-20wt.% epoxy silicone oil (F) of the formula (wherein R is an alkyl or an aryl; R' is an alkyl or aryl which may have an epoxy; and n and m are each >=1) or the like formula is produced by using a silicone-modified epoxy resin and/or a silicone-modified phenolic resin obtained by reacting 20-100% of component A and/or B with 2-80 pts.wt., per 100 pts.wt. component A and/or B, component F at 80-150 deg.C for several tens of min to several hr in a solvent such as methyl isobutyl ketone. |
