| 摘要 |
The hybrid IC circuit has conductive material layers (201, 202) to be selectively connected to conductive layers (121, 122) formed on a sintered substrate (11) and exposed on a surface of the substrate. Conductor layers (151,152) are formed on the conductive material layers so as to be electrically connected. Copper plated layers (211,212) are formed on at least portion of the conductive material layers and the conductor layers are formed on the copper-plated layers. The substrate is constituted by a multilayer substrate obtained by laminating a number of sheet substrates. The sheet substrates are ceramic green sheets which contain an alumina ceramic as the major constituent. |
