| 摘要 |
<p>PURPOSE:To improve operativity in wafer processing by providing a surface part formed of an elastic body adhering to a semiconductor wafer surface with a photoresist film and a rear face part formed of non-viscous body having no viscosity. CONSTITUTION:A jig is constituted of a surface part formed of an elastic body 3 adhering to a surface of a semiconductor wafer 2 with a photoresist film and a rear face part formed of non-viscous body 4 having no viscosity. Therefore, the semiconductor wafer 2 can be sufficiently fixed, so that separate process for fixing the wafer 2 and a surface protecting jig is unnecessary at the time of tilting and processing the semiconductor wafer. Also in process of processing the rear face of the semiconductor wafer 2, the surface of the semiconductor wafer 2 may not be damaged, and since the rear face is protected by the non-viscous material 4, the semiconductor wafer 2 may not adhere to the inner of a manufacturing apparatus. This improves operativity in wafer processing.</p> |
