| 摘要 |
<p>PURPOSE:To protect an IC and components against an erroneous operation or damage caused by heat released from the IC inside a shield case by a method wherein a heat dissipating means formed of a material excellent in thermal conductivity is provided between the inner face of the shield case and the upside of the IC to dissipate heat. CONSTITUTION:A bonding agent or a sheet 4 of excellent thermal conductivity is provided between the upside of an IC 1 and a proximate part 3a of a shield case 3 formed close to the upside of the IC 1 as coming in close contact with them. Therefore, when the IC 1 is put in a continuous operation and heat is released from the IC 1, the heat is conducted to the shield case through the intermediary of the bonding agent or the sheet 4 and the shield case information as a heat dissipating plate to dissipate the heat. By this setup, an IC and a component 6 are protected against an erroneous operation or damage caused by the heat released from the IC inside a shield case.</p> |
