A multiple chip module is provided with an engineering change (EC)/repair facility by means of delete lines located on both major surfaces of the module. In one embodiment, defective pin vias through the module are repaired by use of the delete lines on both major surfaces.
申请公布号
DE3577967(D1)
申请公布日期
1990.06.28
申请号
DE19853577967
申请日期
1985.06.24
申请人
INTERNATIONAL BUSINESS MACHINES CORP., ARMONK, N.Y., US
发明人
FEINBERG, IRVING;KRAUS, CHARLES JOHN, POUGHKEEPSIE, N.Y. 12603, US;STOLLER, HERBERT IVAN, WAPPINGERS FALLS, N.Y. 12590, US
