| 摘要 |
<p>PURPOSE:To prevent the production of a crosstalk by shielding signal lines of a multilayer ceramic semiconductor package and arranging them in different steps. CONSTITUTION:An integrated circuit chip 4 is arranged on a ground or a power source line 1, and is connected via wirings 5 to signal lines 2. The lines 2 are insulated via ceramics 3 at the respective layers, are shielded with the ground or the power source line, and the signal lines are arranged in different steps. Thus, the crosstalk and noise between the lines can be prevented. Since it is not necessary to increase the thickness of the ceramic layer, it is not necessary to lower the integration.</p> |
