| 摘要 |
PURPOSE:To reduce remaining carbon for easily causing a peeling between the layers of a board by temporarily clamping a green sheet with adhesive in which thermally decomposed resin is dissolved in solvent at least in a nonoxidizing atmosphere when the green sheet printed with a wiring pattern and conductor paste is aligned and laminated, and then baking it. CONSTITUTION:A viahole 2 and a profile 3 are punched by a press at a green sheet 1, and copper paste 4 is buried in the viahole 2. Then, 10 of green sheets printed with copper paste 5 according to a wiring pattern on its surface are temporarily clamped with adhesive near the profile 3, superposed, laminated, and integrated. Thereafter, the laminate is baked in a nitrogen atmosphere. In this case, liquid (dissolved in highly viscouse solvent such as terpineol, etc.) in which thermally decomposed polymerizable resin such as acrylic resin is contained as a main ingredient as resin to be thermally decomposed in a nonoxidizing atmosphere is used as the adhesive. |
