发明名称 APPARATUS FOR MOLDING INSULATED TYPE RESIN SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate application work of insulating resin after a suspension pin is cut away without having a difficulty of electric discharge through shearing burrs by providing a suspension pin holder part which is to hold the suspension pin protruding at one end thereof into a cavity and which is movable parallely to a die abutment surface and in a direction where the die is opened and closed. CONSTITUTION:With a suspension pin holding part 11 protrude into a cavity 99, upper and lower molds 9, 10 are approached and a positioning pin 12a is inserted into a hole 11a to hold a suspension pin 1b between the suspension pin holding parts 11, 12 and further tighten the upper and lower molds 9, 10. Further, fluidized resin is injected into the cavities 9a, 10a, and partly hardened, and the upper and lower molds 9, 10 are separated in a fine interval to make the suspension pin holding parts 11, 12 movable parallely to a mold abutment surface and draw them outwardly. Since a coupling member 1c is engaged with the positioning pin 12a, the suspension pin 1b is torn. Sshort-circuiting and electric discharge with an external conductor are eliminated and resin crack is avoided upon the suspension pin being cut away so that a device with satisfactory wet resistance can be manufactured.
申请公布号 JPH02164044(A) 申请公布日期 1990.06.25
申请号 JP19880321310 申请日期 1988.12.19
申请人 NEC KANSAI LTD 发明人 MIMORI OSAMU
分类号 H01L21/56 主分类号 H01L21/56
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