| 摘要 |
<p>PURPOSE:To prevent corrosion of bonding pads on a semiconductor chip by applying a resin coating film on the interface between an outer lead and a resin mold after sealing the semiconductor with the resin mold. CONSTITUTION:A semiconductor chip having outer leads 2 projected outside is provided with a resin mold 1, and then a coating resin 4 is deposited on the exposed interface between the lead and the mold 1. The resin 4 should be deposited in a range wider than the interface for improving moisture resistance.</p> |
