Method for the determination of mechanical defects in brittle material moulded parts, especially ceramic substrate plates

摘要

The invention relates to a method for determining mechanical defects in brittle material moulded parts, especially ceramic substrate plates in thick or thin film technology for electronic circuits. According to the invention, the moulded part to be tested is excited into a mechanical intrinsic frequency oscillation and the actual resonant frequency of this oscillation is compared with a desired resonant frequency of the mechanical intrinsic frequency vibration of at least one sufficiently defect-free, similar reference moulded part.