| 摘要 |
<p>The subject of the invention is a device ensuring hermetic encapsulation of components forming an electronic circuit. The components are each encapsulated in a case (3) made from a plastic material, then the cases are mounted onto a printed circuit board (1) provided with means (4) for electrical connection and with a cover (2) sealed onto the board (1), in such a way as to enclose the cases in a second enclosure (6) so that it is hermetic, the means of connection being left outside the second enclosure. <IMAGE></p> |
