DEVICE FOR ABRADING WAFER AND POSITIONING JIG USED FOR SUCH DEVICE

摘要

PURPOSE:To enable a wafer surface to be abraded in a high degree of flatness and parallelism by a method wherein the wafer center is held at a position which is made slightly eccentric by a specific amount with respect to the turning center of a wafer holding plate. CONSTITUTION:The turning center of a wafer 3 holding plate 4 is made slightly eccentric from the presumptive wafer center in the wall-thickness direction of the wafer 3 on the diameter in parallel with the maximum gradient direction of the tapered wafer 3 without coincidently fixing the turning center of the plate 4 on the presumptive wafer center. Furthermore, within the wafer 3 having an orifla, the wafer 3 is fixed in such a way that the turning center of the plate 4 may be made slightly eccentric from the presumptive wafer center in the inverse direction to the orifla on the diameter having the orifla. Through these procedures, even when the wafer having a slightly tapered surface or the orifla is to be abraded, the wafer surface can be abraded in high degree of flatness and parallelism.