| 摘要 |
<p>PURPOSE:To provide the title compsn. to yield the coating glass which decreases the generation of voids and is excellent in thermal conductivity, wear resistance, etc., by incorporating glass powder having a high difference between the softening point and crystallization temp., inorg. fillers having the high thermal conductivity and an org. vehicle at specific weight ratios into the compsn. CONSTITUTION:The glass paste compsn. is produced by incorporating (A) 100pts. wt. glass powder having >=130 deg.C difference between the softening point and the crystallization temp., (B) 5 to 40pts.wt. inorg. filler (e.g.: AlN, SiC) having >=100w/m.k thermal conductivity, and (C) 8 to 20pts.wt. org. vehicle into the compsn. The resulted glass paste compsn. is applied on a resistor 22 of a heat sensitive head to form an over coating layer 26, by which thermal efficiency, durability, etc., are improved. The heat radiating effect is large if this compsn. is applied to the coating glass for the resistors of thick-film hybrid ICs and, therefore, the electronic device having a small resistance change rate and high reliability is obtd.</p> |
