| 摘要 |
The construction of a vacuum package for electron devices operating at cryogenic temperatures is disclosed. Package provides a silicon-metal multilayer heatpath with lowest thermal impedance between electron device (4) and cryogen (6), comprising a solid silicon body (1) for heat transfer to the external heat sink (6) and a silicon carrier board (3) as mounting cold station for electron device assemblies with high multifunction and integration complexity. Heat transfer component is joined to the package wall by a silicon-glass seal (22). Multilayer heatpath construction uses standard silicon technology and materials which are compatible with requirements for high vacuum integrity performance. A modular package construction flow chart results in high design flexibility, low cost and mass production capability. |
