| 摘要 |
PURPOSE:To enhance the evenness in the flatness and the ground surface by a method wherein the spindle axles in the first and second positions are respectively fitted with the rough grinding and medium grinding blades by down-feed system while the third position is fitted with the finish grinding blade by through-feed system. CONSTITUTION:Chuck tables 5 provided on five positions on a rotary table 4 respectively pass through the five positions by the rotation of the table 4. Firstly, a wafer to be ground up is sucked at a load point 6 and successively rough, medium and finish ground at the first, second and third spindle axles 1, 2 and 3 finally to be taken out of the unload point 7. During the grinding processes at the axles 1, 2 under heavy grinding load, the down-feed system is applied to assure the thickness precision and the flatness while at the axle 3 for finish grinding, the through-feed system is applied to form an evenly ground surface. Through these procedures, the evenness in the flatness an the ground surface can be enhanced. |
