| 摘要 |
PURPOSE:To manufacture a high-dimensional accuracy and high-quality thin integrated circuit device suitable for an IC card at a high efficiency and at low cost by a method wherein an integrated circuit element mounted on a metallic thin plate is covered with a sealing resin and part of the metallic thin plate is used as a terminal for external connection use. CONSTITUTION:An insulative bonding agent 12 is applied on most of one surface 11a of a metallic thin plate 11 excepting the connecting parts of the one surface 11a with gold wires 14. An integrated circuit element 13 is mounted and fixed through this bonding agent 12. Then, input/output electrodes 13a of the element 13 and the one surface 11a of the plate 11 are electrically connected to each other by the wires 14. After that, the element 13, the wires 14 and the side of the one surface 11a of the plate 11 are coated with a sealing resin 15. Subsequently, unnecessary parts of the plate 11 are removed to form the plate 11 into a desired configuration and after a terminal 11c for external connection use is formed, a coupling part 11d is cut and removed to obtain an integrated circuit device in a completed state. |
