摘要 |
A modular extrusion head (10) is disclosed including a plurality of cross head die modules (16, 18, 20, 22, 24), each including a flow path for a single resin. Molten resin layers are flowed from the modules onto a stepped mandrel and then along the mandrel and out an extrusion die to form a multi-layer parison. The layers are thin, with a uniform thickness and hole free. The modules are temperature zoned to permit flowing of a low temperature resin to and among the mandrel in contact with a high temperature resin without impairing the properties of the low temperature resin. |
申请人 |
GENERAL ELECTRIC CO., SCHENECTADY, N.Y., US;GRAHAM ENGINEERING CORP., YORK, PA., US |
发明人 |
BRIGGS, MILTON, YORK PA 17403, US;TEUTSCH, ERICH OTTO, MARIETTA GA 30062, US |