发明名称 REPAIR OF PRINTED WIRING BOARD
摘要 PURPOSE:To make the repaired surface of a printed wiring board smooth at finishing by a method wherein conductive paste is filled in a spot-faced part, which is formed sufficiently including a disconnection part of wiring an a region of a damaged part of a pad, to make it level with the other wiring or pads, and the conductive paste is reflowed and fixed. CONSTITUTION:A circular region, which covers an adjacent wiring 2 spreading over a disconnected part of a printed wiring board 1, is subjected to a spot facing process using a drill or an end mill. Next, a conductive paste 3 is filled into a spot-faced part 5 to make it level with the face of the other wiring. In succession, the wiring board 1 or the paste 3 is heated to fuse the paste 3 to connect the disconnected wiring 2. When a damaged part 8 occurred in a pad section 4 of the wiring board 1 is repaired, a circular spot-faced plane which covers all the region of the damaged part 8 is formed. Then, a conductive paste 3a is filled into the spot-faced part, then the paste filled part is heated to fuse the paste 3a, and the damage part 8 is fixed with the paste 3a.
申请公布号 JPH02153591(A) 申请公布日期 1990.06.13
申请号 JP19880308197 申请日期 1988.12.05
申请人 NEC CORP 发明人 OKUNO HISAKI
分类号 H05K3/22 主分类号 H05K3/22
代理机构 代理人
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