A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount sufficient for forming the wire loop with the wire being played out, moving the capillary over the second bonding point along a circular track which has a radius sufficient for forming the wire loop, and connecting the wire to the second bonding point.
