| 摘要 |
PURPOSE:To obtain a clear sectional image of the surface border of a section and holes by filming the area including the sectional position. CONSTITUTION:The positions of trenches 1 of a sample are located, by a scanning electron microscope image, the area 3 including the trenches 1 are filmed by a focused ion beam CVD method, and the holes in the area 3 are filled up to smooth the upper surface. Then, a square hole 4 is made by making the sectonal position 2 to observe as one side by the etching function. This process includs two steps, a rough hole making and a finish process, to make a rapid and accurate sectonal process. After that, the sample stage is faced to expose the processed section in the ion beam radiation direction. By repeating such an operation, a cubic display image is obtained. In such a way, the influence of the unevenness on the surface is prevented from appearing as longitudinal lines in the section, and a clear sectional image of the surface border of the section and the holes can be obtained. |
