发明名称 |
Method and apparatus for determining throwing power of an electroplating solution |
摘要 |
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
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申请公布号 |
US4932518(A) |
申请公布日期 |
1990.06.12 |
申请号 |
US19890438021 |
申请日期 |
1989.11.20 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
BERNARDS, ROGER F.;FISHER, GORDON;SONNENBERG, WADE |
分类号 |
C25D3/38;H05K3/42 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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