发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To increase the length of a capacity of a wire bonding apparatus, vibrating a working head, and to limit a working range by increasing the protruding distance of the capillary from an ultrasonic horn so that the horn does not collide with a substrate during working. CONSTITUTION:A long capillary having two or more resonance nodes is employed as a normally used capillary 3, and attached to an ultrasonic horn 4 having a smaller inertia than that of a stage 2, an easily high speed motion and a short length. The horn 4 is secured to a holding block 5, and the capillary 3 is vertically moved by its rotation in a direction of an arrow A on the pivot 7a of the block 5. The block 5 is rotatably held by the pivot 7a in a housing block 7, and rotated through a spring 6. The block 7 is held in a block 8, and rotatably driven around the shaft of a servo motor 9 attached to the block 8 in a direction of an arrow A by a cam 10.
申请公布号 JPH02148749(A) 申请公布日期 1990.06.07
申请号 JP19880299634 申请日期 1988.11.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ENDO TAKAHIRO;KANAYAMA SHINJI;MURAOKA NOBUHIKO;NAKAMURA HITOSHI;MINAMITANI SHOZO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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