| 摘要 |
<p>Simultaneous solder connections of multiple electrical terminals (20,21) respective electrical leads (30) is achieved by conducting thermal energy from an actuable heater body (10) to the multiple connection sites via the terminals (20,21) themselves, the terminals (20,21) being formed integrally with the heater body (10). The terminals (20,21) are scored or perforated, to facilitate severance from the heater body (10) after soldering. The preferred heater body (10) takes the form of a copper substrate (17) having a skin depth surface layer (29) of magnetically-permeable, high resistance alloy. Alternating current of constant amplitude and high frequency is passed through the heater body (10) and concentrated in the surface layer (29) at temperatures below the Curie temperature of the alloy. For higher temperatures the current is distributed through the lower resistance substrate (17) to limit further heating. During the time interval required for the surface layer (29) to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt solder that is pre-deposited on the terminals (20,21) and/or leads (30).</p> |
