| 摘要 |
PURPOSE:To hold a bare chip to a substrate horizontally against a substrate at die bonding and to realize stability of sealing by forming a bonding land in scattering on a substrate and sealing the bare chip onto the bonding land with adhesive which is applied to a surface of the substrate which is exposed between bonding lands. CONSTITUTION:A bonding land 12 is formed in scattering in an arbitrary range on a substrate 10 whereon a bare chip 16 is mounted. A bare chip 16 is sealed onto a bonding land 12 with adhesive 14 which is applied to a surface of the substrate 10 which is exposed between bonding lands 12. For example, said bonding land 12 consists of a grounding/radiating conductor 12A to carry out grounding and radiation and an auxiliary conductor 12B to stabilize sealing of the bare chip 16 which is located at a specified interval at both side thereof. A bonding pad 20 which is interconnected to a lead pin of an IC, respectively is provided to a periphery section of the bonding land 12. Ag paste, etc., having electric and heat conductivity is used as said adhesive 14. |
