发明名称 |
High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package |
摘要 |
The invention discloses an improved integrated circuit package having enhanced thermal conductivity comprising a molding or encapsulation resin having a semiconductor filler material. In a preferred embodiment, the semiconductor filler material comprises a high purity doped semiconductor to reduce alpha errors caused by alpha emisison normally caused by the use of fillers containing trace amounts of radioactive impurities and to provide enhanced thermal conductivity.
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申请公布号 |
US4931852(A) |
申请公布日期 |
1990.06.05 |
申请号 |
US19880180421 |
申请日期 |
1988.04.12 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BROWN, CANDICE H.;FATEMI, HOMI |
分类号 |
H01L23/29;H01L23/42;H01L23/556 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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