| 摘要 |
<p>PURPOSE:To form a board, for semiconductor mounting use, which can be made small-sized and thin and whose connection reliability is high by a method wherein a protrusion-shaped pad is formed in a signal-line extraction part on the rear of the board. CONSTITUTION:A copper foil or a copper sheet is stamped out by using a die in order to form copper pieces 5 used as pads 4 in positions corresponding to through holes 2 in signal-line extraction parts on a board 1 and in order to form parts 6 used to connect the copper pieces mutually; in succession, parts where the pads 4 used as the signal-line extraction parts on the board 1 are coated with a conductive adhesive. Then, the copper pieces 5 formed beforehand are aligned with and pasted on the parts where the pads 4 are formed; the adhesive is hardened. Lastly, the parts 6 which connect the copper pieces 5 mutually are removed by a method such as an etching operation, a laser cutting operation or the like; the protrusion-shaped pads 4 are formed. It is preferable to set a height of the pads 4, i.e. a thickness of the copper foil used to form the copper pieces 5, at a range of 0.005 to 3mm.</p> |
