| 摘要 |
A leadframe assembly (10) has conductive elements (12) preformed with solder bumps (16) for use in inter-connecting a leadframe with an electronic device. The leadframe comprises at least one of power, ground, and signal conductive elements for transmitting input and output signals to bonding locations (46) on an electronic device (42). Solder bumps are preformed on the conductive elements for selective bonding with bonding locations on the electronic device. |
