SEMICONDUCTOR CHIP HAVING EXTERNAL TERMINALS CONNECTED TSEMICONDUCTOR CHIP HAVING EXTERNAL TERMINALS CONNECTED TO CORRESPONDING LEADS BY WIRES O CORRESPONDING LEADS BY WIRES

摘要

A resin-encapsulated integrated circuit has a semiconductor chip (2) whose bonding pads (2A) are connected to corresponding leads (3A) by wires (4). In order to achieve the correct interconnection of pads (2A) and leads (3A) some of the wires (4) intersect and to prevent short circuits they are coated in an insulator. This permits great design versatility as the pads and leads may be positioned as desired, rather than having interconnected pads and leads adjacent each other, as is normal. The use of insulated wires also permits one or more of the bonding pads to be central on the chip rather than at its periphery, and some of the pads may be connected to remote leads.